Reviewing Cooling Strategies for Post-Dennard Era Computing and Modern Electrothermal Phenomena
DOI:
https://doi.org/10.47611/jsrhs.v12i4.5673Keywords:
Dennard, Fan-heatsink, Liquid-cooling, Semiconductor, Computing, CPU, Moore's Law, TDP, OverclockingAbstract
Excessive thermal runaway typically manifests itself in computer component damage and other various negative side effects. As a mitigation strategy, end-users and consumers typically implement differing methods of component cooling, including fan-heatsink cooling, heatsink-only cooling, and liquid-based cooling. Different cooling methods remain impactful to modern computing, as it remains a core component in the thinking of thermal design and reliability engineering in the realm of semiconductor devices. The industry-wide acceptance of the end of Dennard scaling and the imminent end of Moore’s law are major factors that are currently impacting CPU power consumption trends and modern cooling philosophies. Transistor packing and process refinement is beginning to push against atomic boundaries in combination with phenomena such as leakage current and high current density, causing a general trend of increasing temperatures generation-to-generation in microprocessors. As a result, thermal mitigation strategies and protections must be in place to reduce damage and catastrophic failure while increasing performance of the die package. In a high-heat scenario, liquid-cooling can provide up to 38% to 48% improvement over fan-heatsink variants depending on the type of workload executed by the processor. Fan-heatsink cooling faces thermal resistance limitations in the form of spreading and air convection resistance as a result of heatsink material composition, the resistance along the path of heat flow impeding conduction rate, and the lower thermal conductivity of air compared to liquid. Currently, the best performing variant appears to be liquid-based cooling while fan-heatsink combinations provide adequate levels of thermal dissipation based on these observations.
Downloads
References or Bibliography
Bohr, M. (2007, Winter). A 30 Year Retrospective on Dennard’s MOSFET Scaling Paper. IEEE Solid-State Circuits Society, 12(1), 11-13. doi:10.1109/N-SSC.2007.4785534
Cavin, K. R., Lugli, P., Zhirnov, V. V. (2012, April). Science and Engineering Beyond Moore’s Law. Proceedings of the IEEE, 100(Special Centennial Issue), 1720-1749. doi:10.1109/JPROC.2012.2190155
Esmaeilzadeh, H., Blem, E., Amant, S. R., Sankaralingam, K., Burger, D. (2011, June). Dark silicon and the end of multicore scaling. In ISCA ’11: Proceedings of the 38th annual international symposium on Computer architecture (pp. 365-376). Association for Computing Machinery. doi:10.1145/2000064.2000108
Fan, Y., Winkel, C., Kulkarni, D., Tian, W., (2018, Summer). Analytical Design Methodology for Liquid Based Cooling Solution for High TDP CPUs. In 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 582-586). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ITHERM.2018.8419562
Ilsche, T., Schöne, R., Joram, P., Bielert, M., Gocht, A. (2018, May). System Monitoring with Io2s: Power and Runtime Impact of C-State Transitions. In 2018 IEEE International Parallel and Distributed Processing Symposium Workships (IPDPSW) (pp. 712-715). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/IPDPSW.2018.00114
Jalili, M., Manousakis, I., Goiri, I., Misra, A. P., Raniwala, A., Alissa, H., Ramakrishnan, B., Tuma, P., Belady, C., Fontoura, M., Bianchini, R. (2021, June). Cost-Efficient Overclocking in Immersion-Cooled Datacenters. In 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture (ISCA) (pp. 623-636). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ISCA52012.2021.00055
Kuzay, M., Dogan, A., Yilmaz, S., Herkiloglu, O., Atalay, S. A., Cemberci, A., Yilmaz, C., Demirel, E. (2022, August). Retrofitting of an air-cooled data center for energy efficiency. Case Studies in Thermal Engineering, 36. doi:10.1016/j.csite.2022.102228
Leong, M., Narayanan, V., Singh, D., Topol, Anna., Chan, V., Zhibin R. (2006, June). Transistor scaling with novel materials. Materials Today, 9(6), 26-31. doi:10.1016/S1369-7021(06)71540-1
Mazouz, A., Laurent, A., Pradelle, B., Jalby, W. (2013, Summer). Evaluation of CPU frequency transition latency. SICS Software-Intensive Cyber-Physical Systems, 29, 187-195. doi:10.1007/s00450-013-0240-x
Nylander, A., Darmawan, C. C., Boyon, B. A., Divay, L., Samani, K. M., Ras, A. M., Fortel, J., Fu, Y., Ye, L., Ziaei, A., Liu, J. (2018, September). Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials. In 2018 24th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (pp. 1-5). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/THERMINIC.2018.8593282
Pedram, M., & Nazarian, S. (2006, August). Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods. Proceedings of the IEEE, 94(8), 1487-1501. doi:10.1109/JPROC.2006.879797
Ramakrishnan, B., Alissa, H., Manousakis, I., Lankston, R., Bianchini, R., Kim, W., Baca, R., Misra, A. P., Goiri, I., Jalili, M., Raniwala, A., Warrier, B., Monroe, M., Belady, C., Shaw, M., Fontoura, M. (2021, August). CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11(10), 1703-1715. doi:10.1109/TCPMT.2021.2106026
Rodi, R. A., Leon, C. D. (2012, Fall). Correction of static pressure on a research aircraft in accelerated flight using differential pressure measurements. Atmospheric Measurement Techniques, 5(11), 2569-2579. doi:10.5194/amt-5-2569-2012
Schöne, R., Ilsche, T., Bielert, M., Gocht, A., Hackenburg, D. (2019, July). Energy Efficiency Features of the Intel Skylake-SP Processor and Their Impact on Performance. In 2019 International Conference on High Performance Computing & Simulation (HPCS) (pp. 399-406). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/HPCS48598.2019.9188239
Shia, D., & Yang, J. (2020, July) Analytical, Numerical and Experimental Study of Phase Change Material in TIM2 Application for High-Power Server CPUs. In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 158-165). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ITherm45881.2020.9190178
Shia, D., Yang, J., Sivapalan, S., Soeung, R., Amoah-Kusi, C. (2021, June). On Cold Plate Corrosion with Propylene Glycol/Water Coolant. In 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (pp. 212-219). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ITherm51669.2021.9503231
Siddarth, A., Eiland, R., Fernandes, E. J., Agonafer, D. (2018, June). Impact of Static Pressure Differential Between Supply Air and Return Exhaust on Server Level Performance. In 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (pp. 953-961). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ITHERM.2018.8419536
Su, H., Liu, F., Devgan, A., Acar, E., Nassif, S. (2003, August). Full chip leakage-estimation considering power supply and temperature variations. In Proceedings of the 2003 International Symposium on Low Power Electronics and Design, 2003. ISLPED ’03. (pp. 78-83). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/LPE.2003.1231839
Taylor, B. M. (2012, June). Is dark silicon useful?: harnessing the four horsemen of the coming dark silicon apocalypse. In DAC ’12: Proceedings of the 49th Annual Design Automation Conference (pp. 1131-1136). Association for Computing Machinery. doi:10.1145/2228360.2228567
Thomas, D., & Shanmugasundaram M. (2018, March). A Survey on Different Overclocking Methods. In 2018 Second International Conference on Electronics, Communication and Aerospace Technology (ICECA). Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICECA.2018.8474921
Vassighi, A., & Sachdev, M. (2006). Thermal and Power Management of Integrated Circuits. Springer.
Zhang, Z., Wang, X., Yan, Y. (2021). A review of the state-of-the-art in electronic cooling. e-Prime – Advances in Electrical Engineering, Electronics and Energy, 1. doi:10.1016/j.prime.2021.100009
Published
How to Cite
Issue
Section
Copyright (c) 2023 Tyler Sapasap; Xicotencatl Rojas
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License.
Copyright holder(s) granted JSR a perpetual, non-exclusive license to distriute & display this article.
